High-Temp Polyimide Masking Tape

Protect your most sensitive electronics with Funsmt’s Premium Polyimide Tape. Engineered for the rigors of SMT reflow and wave soldering, this high-performance masking tape combines exceptional thermal stability with superior dielectric insulation, ensuring residue-free protection for gold fingers, PCB components, and lithium batteries.

Industrial-Grade Performance

• Extreme Thermal Stability: Rated for continuous operation between 260°C and 280°C, making it ideal for the high-temperature environments of lead-free soldering processes.

• Superior Chemical & Solvent Resistance: Formulated to withstand aggressive cleaning solvents and flux, maintaining a secure bond without degradation or edge lifting.

• Residue-Free Silicone Adhesive: Features a premium pressure-sensitive silicone resin that adheres firmly to uneven surfaces but can be released easily after heating, leaving zero adhesive ghosting or residue on your gold fingers.

• Advanced Dielectric Insulation: Provides high-tier electrical insulation, making it the trusted choice for splicing wires, motor insulation, and protecting high-density lithium-ion battery packs.

Technical Specifications

Critical Applications

1. SMT Gold Finger Masking: Protects sensitive PCB edge connectors during wave soldering or hot air leveling (HASL).

2. Lithium Battery Insulation: Provides a heat-resistant barrier and structural wrap for power cells, preventing internal shorts.

3. Coil & Motor Wrapping: Ideal for high-temperature motor insulation and wire splicing where traditional tapes would melt or fail.

4. 3D Printing Bed Surface: A preferred surface for 3D printer heat beds to ensure proper adhesion of specialized filaments.

Professional Usage Instructions

1. Preparation: Ensure the surface is clean, dry, and free of oil or flux residue for maximum adhesion.

2. Application: Unroll the desired length and cut with a precision blade or dispenser. Place the tape precisely over the area requiring masking or insulation.

3. Bonding: Apply firm, even pressure across the surface of the tape to eliminate air bubbles and ensure a complete seal.

4. Removal: After the heating cycle is complete and the board has slightly cooled, peel the tape at a 45-degree angle for the cleanest release.